Mobile Industry Processor Interface

The Mobile Industry Processor Interface (MIPI®) Alliance is an open membership organization that includes leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces inside mobile terminals.

Formed in July 2003 by Intel, Nokia, Samsung, STMicroelectronics and Texas Instruments, MIPI aims to shave complexity and costs while boosting flexibility for cell phones and the chips that drive them[1].

MIPI has several working groups:

  • Battery Interface (BIF) Working Group
  • Camera Working Group
  • DigRF (interconnect between the RFIC and the baseband BBIC)
  • Display Working Group (defined Display Serial Interface)
  • High-Speed Synchronous Interface (HSI) Working Group
  • Low Latency Interface (LLI) Working Group
  • Low-Speed Multipoint Link (LML) Working Group (defined Serial Low-power Inter-chip Media Bus, SLIMbus)
  • NAND Software Working Group
  • Peripheral and interconnect Low-level Framework Working Group
  • Physical (PHY) Layer Working Group
  • RF Front-End Control Working Group
  • Software Working Group
  • System Power Management Working Group
  • Debug Working Group
  • UniProSM Working Group (high speed interconnect; also defines the UniPro protocol stack)

The working groups strive to define common standards.

External links

References

  1. ^ EE Times, "Mobile chip interface gets real" (Feb 2006)

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